Method for Measuring Surface Activity of Silicon Nitride Powder

Pattern Photoresist Silicon Silicon Nitride Silicon Photoresist Silicon Nitride Silicon Etch Nitride Remove Photoresist

In this proposal we seek to establish a porous silicon based etching process in the WTC microfabrication laboratory. The new process will allow us to etch high aspect ratio holes through a wafer. Holes like these are important for decreasing the dead volume of connections between micro and macro systems and for increasing the complexity of micro-fluidic systems. At the present time, the minimum...

Surface Characteristics and Catalytic Activity of Copper Deposited Porous Silicon Powder

Porous structured silicon or porous silicon (PS) powder was prepared by chemical etching of silicon powder in an etchant solution of HF: HNO₃: H₂O (1:3:5 v/v). An immersion time of 4 min was sufficient for depositing Cu metal from an aqueous solution of CuSO₄ in the presence of HF. Scanning electron microscopy (SEM) analysis revealed that the Cu particles aggregated upon an increase in metal co...

Silicon Nitride and Silicon Carbide

Modelling Temperature Dependency of Silicon Nitride Formation Kinetic during Reaction Bonded Method

An accurate prediction of reaction kinetics of silicon nitridation is of great importance in designing procedure of material production and controlling of reaction. The main purpose of the present study is to investigate the effect of temperature on the kinetics of reaction bonded silicon nitride (RBSN) formation. To achieve this, nitrogen diffusion in the silicon nitride layer is considered as...

MICROSTRUCTURAL STUDY OF SILICON NITRIDE WHISKERS PRODUCED BY NITRIDATION OF PLASMA-SPRAYED SILICON LAYERS

plasma-sprayed silicon layers have been used to produce silicon nitride layers with fibrous microstructure which optimizes fracture toughness and strength. SEM examination of the specimens shows that the surface is covered by fine needles and whiskers of Si3N4.In order to study the oxygen contamination effect as well as other contaminants introduced during spraying and nitridation processes, su...